Datavision
Datavision is a versatile data analysis and storage product that also provides automation, SPC, trending and cross correlation of large volumes of data from multiple sources. Instead of using point solutions for analysing and correlating each data source, Datavision is a central point for consistent data storage, analysis and advanced applications in automated data handling.

The traditional single criteria on whether a die is good or bad is being replaced by multiple criteria such as no defects on the die, bond pads in good condition, test measurements similar to other good die on the wafer (Part Average Testing) and the die not being in a low yielding region of the wafer (Good Die in Bad Neighbourhood).

These new criteria require the open, automated analysis system capabilities that Datavision delivers.

Please visit our Datavision page for detailed information and product screenshots.

ASSA
(Advanced Spatial Signature Analysis) is a standalone analysis tool that automatically detects and reports on spatial signatures in defect files from patterned and un-patterned wafers. Using advanced algorithms based on a simple approach, the signature detection rate is high without any product configuration. ASSA is developed by AOVtech and is distributed and supported in Europe by Waferdata.

Please visit the AOVtech web site for further information.