Wafer Map performance upgraded Extended functionality and improved performance.
Wafer Maps of over 65K die can be displayed
Time to display large maps reduced
Zoom and Scroll enhanced for large die counts
A fixed legend can be applied to any wafer map
Jan '08
Web Reports Added Allows remote intranet access to data via custom reports.
Web server's CGI scripts call "Batch" files
Reports are customisable
Spreadsheets or Plots displayed
Database data turned into reports by Datavision
Aug '07
Improvements to "Batch" Enhancements and bug fixes.
Dec '06
New loader for fab in-line data Allows analysis and correlation of in-line data with wafer test data.
Oct '06
Datavision 5.1 released Many new and improved features.
Multiple user limits files
Relimit from file
Merge spreadsheet columns
Table of Contents upgraded
Bug Fixes
Updated Compilers
Apr '06
GDBN article published in the ENCAST Good-Die newsletter Read the article.
Dec '05
STDF¹ repair tool added Corrupt STDF¹ files can now be repaired.
Nov '05
Data loaders upgraded Loaders now accept compressed files.
Oct '05
"Good Die in Bad Neighbourhood" module introduced This module allows good die on a wafer to be down-graded when surrounded by bad die in a pre-configured pattern.
Jul '05
Datavision 5.0 released This is Waferdata's first major release of Datavision and brings the product right up to date.
Upgraded Database
Interbase¹ version 7.5
Upgraded Graphics Library
HOOPS 3dAF¹ version 12
Upgraded Graphics
Printing and Save to File
Upgraded Functionality
Automation
Bug Fixes
Updated Compilers
¹ STDF, Interbase and HOOPS 3dAF are trademarks of Teradyne Inc, Borland Software Corporation and Tech Soft America LLC, respectively.
Copyright 2006 Waferdata Limited, all rights reserved.
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